|
Project |
Process Capability |
Detailed Explanation of PCB Process |
|
Number of Layers |
2 - 30 Layers PCB Circuit Board |
The number of PCB layers refers to the number of layers in the design file. |
|
Board Material Type |
FR-4 Rigid Board / Aluminum Substrate |
FR-4 Board Material (Grade A Kingboard Material, Grade A Guojiji Material) / Aluminum-based Board Material {Halogen-free Circuit Board} |
|
Ink |
Guangxin / Rongda / Lanbang |
The quality of the ink directly affects the solder resistance performance of the PCB, and thus directly affects the performance of the product. |
|
Maximum Specification |
680mm * 1200mm |
The maximum specification for double-sided PCB board production: 680x1200mm, and the maximum specification for four- and six-layer PCB board production: 680x640mm |
|
Board Thickness Range |
0.4 - 2.0mm |
Currently, the custom-produced PCB board thicknesses are: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 - 3.0mm |
|
Outer Dimension Accuracy |
±0.15mm |
The CNC outer shape tolerance is ±0.15mm, and the V-cut board outer shape tolerance is ±0.15mm |
|
Board Thickness Tolerance (t≥1.0mm) |
±10% |
Please note for this item: Due to production process reasons (copper deposition, solder resistance, and pad plating will increase the board thickness), it generally has a positive tolerance. |
|
Board Thickness Tolerance (t<1.0mm) |
±0.1mm |
Please note for this item: Due to production process reasons (copper deposition, solder resistance, and pad plating will increase the board thickness), it generally has a positive tolerance. |
|
Minimum Line Width and Spacing |
4mil/4mil (0.1mm) |
Currently, 4mil line width and spacing can be custom-produced. The line width and spacing should preferably be greater than 4mil. |
|
Minimum Hole Diameter |
0.2mm |
Currently, 0.2mm hole diameter can be custom-produced. The hole diameter should preferably be greater than 0.2mm. |
|
Minimum Clearance |
4mil (0.1mm) |
Currently, 4mil line spacing can be produced. The clearance should preferably be greater than 4mil. |
|
Finished Product Outer Layer Copper Thickness |
35um/70um/105um (1 OZ/2 OZ/3 OZ) |
It refers to the thickness of the outer layer circuit copper foil of the finished circuit board. 1OZ = 35um, 2OZ = 70um, 3 OZ = 105um |
|
Finished Product Hole Diameter (Machine Drilled) |
0.25 - 6.5mm |
Since the inner wall of the hole is coated with metallic copper, the finished product hole diameter is generally smaller than the drilled hole diameter in the file. |
|
Hole Diameter Tolerance (Machine Drilled) |
±0.075mm |
The tolerance of the drilled hole is ±0.075mm. For example, for a hole designed to be 0.6mm, the finished product hole diameter of the physical board between 0.525 - 0.675mm is acceptable. |
|
Solder Mask Color |
Green / Red / Blue / White / Black / Purple... |
The solder mask color refers to the ink color of the solder mask layer on the PCB surface. |
|
Minimum Character Width |
≥0.15mm |
The minimum width of the character. If it is less than 0.15mm, the characters on the physical board may be unclear due to design reasons. |
|
Minimum Character Height |
≥0.8mm |
The minimum height of the character. If it is less than 0.8mm, the characters on the physical board may be unclear due to design reasons. |
|
Character Width-to-Height Ratio |
1:5 |
The most suitable width-to-height ratio is more conducive to production. |
|
Distance between Traces and Outer Shape |
≥0.3mm(12mil) |
For boards shipped by routing, the distance between the traces on the circuit layer and the outer shape line of the board should not be less than 0.3mm. For V-cut panelized boards shipped, the distance between the traces and the V-cut center line should not be less than 0.4mm. |
|
Panelization: Gap for Gapless Panelization |
0 Gap Panelization |
For panelized boards shipped, the gap between adjacent boards is 0 (detailed in the document). |
|
Panelization: Gap for Panelization with Gap |
1.6mm |
The gap for panelization with gap should not be less than 1.6mm. Otherwise, it will be difficult to route the edges. |
|
PCB Outer Shape Process Edge |
0.3mm / 0.5mm |
The conventional process edge is 0.5mm. If there are special requirements, please inform in advance. |
|
Pads Manufacturer's Copper Pouring Method |
Copper Pouring in Hatch Method |
The manufacturer uses reduced copper pouring. Customers who design with Pads must pay attention to this item. |
|
Drawing Grooves in Pads Software |
Use the Drill Drawing Layer |
If there are many non-metallized grooves on the board, please draw them on the Drill Drawing layer. |
|
Windowing Layer in Protel/dxp Software |
Solder Layer |
A few engineers mistakenly place it on the paste layer, and no processing is done on the paste layer. |
|
Half-hole Process |
The number is no more than 10 |
The half-hole process is a special process. The minimum hole diameter should not be less than 1.0mm. |
|
Single-sided Welding Ring of Through Hole (t<1.0mm) |
4mil {0.1mm} |
The parameter is the minimum value. It is better to be greater than this parameter. |
|
Minimum Inner/Outer Diameter of Through Hole |
Inner diameter 0.2mm, outer diameter 0.45mm |
For double-sided boards, the minimum inner diameter is 0.3mm and the minimum outer diameter is 0.6mm. For multi-layer boards, the minimum inner diameter is 0.2mm and the minimum outer diameter is 0.45mm. |
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